Phenolic molding compound NSPF-7602
Phenolic molding compound NSPF-7602
Phenolic molding compound NSPF-7602
- Product Details
[Product description]
This product uses phenolic resin as the base material, and uses wood flour and minerals as the filler. It is used to manufacture various low-voltage electrical appliances, insulating structural parts of meters, textile machinery accessories and living cooking utensils and handles, such as electrical switches, contactors, electric baking pans, toasters, sandwich bread ovens, grills, handles, etc.
[Main Specifications]
NSPF-7602 | ||
project | ratio | NSPF-7602 |
Fluidity mm | Agreed | |
Flexural strength MPa | ≥ | 80 |
Tensile fracture stress MPa | ≥ | 50 |
Impact strength of simply supported beam (notch) kJ/m2 | ≥ | 1.3 |
Impact strength of simply supported beam (without notch) kJ/m2 | ≥ | 5.0 |
Load heat distortion temperature Ti 1.8 ℃ | ≥ | 160 |
Flammability (flame retardant UL94) | - | |
Insulation resistance Ω | ≥ | 109 |
Dielectric loss factor (tanδ) (100Hz) | ≤ | 0.1 |
Mold shrinkage% | 0.6-0.9 | |
Water absorption mg | ≤ | 100 |
density | 1.45-1.55 | |
Forming method | Injection or transfer mold | |
Note: Liquidity (flat plate) and shrinkage rate indicators are negotiated by both parties
[Applications]
