Phenolic molding compound NSPF-7501
Phenolic molding compound NSPF-7501
Phenolic molding compound NSPF-7501
- Product Details
[Product description]
This product uses phenolic resin as the base material, and uses wood flour and minerals as the filler. Used in the manufacture of various low-voltage electrical appliances, insulating structural parts of meters, textile machinery accessories, living cooking utensils and handles, such as electrical switches, contactors, terminal blocks, automobile lamp holders, handles, etc.
[Main Specifications]
NSPF-7501 | ||
project | ratio | NSPF-7501 |
Fluidity mm | Agreed | |
Flexural strength MPa | ≥ | 70 |
Tensile fracture stress MPa | ≥ | 40 |
Impact strength of simply supported beam (notch) kJ/m2 | ≥ | 1.3 |
Impact strength of simply supported beam (without notch) kJ/m2 | ≥ | 4.5 |
Load heat distortion temperature Ti 1.8 ℃ | ≥ | 160 |
Flammability (flame retardant UL94) | - | |
Insulation resistance Ω | ≥ | 1010 |
Dielectric loss factor (tanδ) (100Hz) | ≤ | 0.1 |
Mold shrinkage% | 0.5-0.9 | |
Water absorption mg | ≤ | 100 |
density | 1.40-1.50 | |
Forming method | Molded | |
Note: Liquidity (flat plate) and shrinkage rate indicators are negotiated by both parties
[Applications]
