Phenolic molding compound NSPF-7601
Phenolic molding compound NSPF-7601
Phenolic molding compound NSPF-7601
- Product Details
[Product description]
This product uses phenolic resin as binder and wood flour and minerals as filler. Used in the manufacture of various low-voltage electrical appliances, insulating structural parts of meters, textile machinery accessories, and life cooking utensils and handles, such as electrical switches, contactors, electric irons, electric baking pans, toasters, sandwich bread ovens, grills, etc. Handle etc.
[main technical indicators]
NSPF-7601 | ||
project | ratio | NSPF-7601 |
Fluidity mm | Agreed | |
Flexural strength MPa | ≥ | 80 |
Tensile fracture stress MPa | ≥ | 50 |
Impact strength of simply supported beam (notch) kJ/m2 | ≥ | 1.3 |
Impact strength of simply supported beam (without notch) kJ/m2 | ≥ | 5.0 |
Load heat distortion temperature Ti 1.8 ℃ | ≥ | 160 |
Flammability (flame retardant UL94) | V-0 | |
Surface resistivity Ω | ≥ | 1010 |
Dielectric loss factor (tanδ) (100Hz) | ≤ | 0.10 |
Mold shrinkage% | 0.5-0.9 | |
Water absorption mg | ≤ | 100 |
density | 1.40-1.50 | |
Forming method | Injection or transfer mold | |
Note: Liquidity (flat plate) and shrinkage rate indicators are negotiated by both parties
[Applications]
