Phenolic molding compound NSPF-7830
Phenolic molding compound NSPF-7830
Phenolic molding compound NSPF-7830
- Product Details
[Product description]
This product is based on phenolic resin, reinforced by glass fiber and filled with minerals. Suitable for injection molding or transfer molding. It has good dimensional stability at high temperature and is mainly used to manufacture products such as insulation structural parts with high mechanical strength or good heat resistance. Such as: high-strength contactor, commutator, commutator, etc.
[Main Specifications]
NSPF-7830 | ||
project | ratio | NSPF-7830 |
Fluidity mm | Agreed | |
Flexural strength MPa | ≥ | 100 |
Tensile fracture stress MPa | ≥ | 65 |
Impact strength of simply supported beam (notch) kJ/m2 | ≥ | 6.0 |
Impact strength of simply supported beam (without notch) kJ/m2 | ≥ | 2.0 |
Load heat distortion temperature Ti 1.8 ℃ | ≥ | 200 |
Flammability (flame retardant UL94) | V0 | |
Surface resistance Ω | ≥ | 1010 |
Dielectric loss factor (tanδ) (100Hz) | ≤ | 0.25 |
Mold shrinkage | 0.25-0.50 | |
Water absorption mg | ≤ | 50 |
density | ≤ | 1.65-1.75 |
Forming method | Injection or transfer mold | |
Note: Liquidity (flat plate) and shrinkage rate indicators are negotiated by both parties
[Applications]
